FEPF6
FEATURES
- Power pack
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of
245 °C (for TO-263AB package)
- Solder dip 275 °C max. 10 s, per JESD 22-B106
(for TO-220AB and ITO-220AB package)
- AEC-Q101 qualified
(for ITO-220AB and TO-263AB package)
- Material categorization: for definitions of pliance please see .vishay./doc?99912
TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, DC/DC converters, and other power switching application.
MECHANICAL DATA Case: TO-220AB, ITO-220AB, D2PAK (TO-263AB) Molding pound meets UL 94 V-0 flammability rating Base P/N-E3
- Ro HS-pliant, mercial grade Base P/NHE3
- Ro HS-pliant, AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker...
