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FES8AT - Ultrafast Plastic Rectifier

Key Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low leakage current.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. , 10 s per JESD 22-B106 (for TO-220AC and ITO-220AC package).
  • AEC-Q101 qualified.
  • Material categorization: for definitions of compliance.

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Datasheet Details

Part number FES8AT
Manufacturer Vishay
File Size 138.48 KB
Description Ultrafast Plastic Rectifier
Datasheet download datasheet FES8AT Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com FES8xT, FESF8xT, FESB8xT Vishay General Semiconductor Ultrafast Plastic Rectifier TO-220AC ITO-220AC FES8xT PIN 1 PIN 2 2 1 CASE TO-263AB K FESF8xT PIN 1 PIN 2 2 1 2 1 FESB8xT PIN 1 PIN 2 K HEATSINK PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF TJ max. Package 8.0 A 50 V to 600 V 125 A 35 ns, 50 ns 0.95 V, 1.30 V, 1.50 V 150 °C TO-220AC, ITO-220AC, TO-263AB Diode variations Single die FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max.