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GI1001 - Ultra Fast Sinterglass Diode

Key Features

  • High temperature metallurgically bonded construction.
  • Glass passivated cavity-free junction.
  • Superfast recovery time for high efficiency.
  • Low forward voltage, high current capability.
  • Hermetically sealed package.
  • High surge capability Mechanical Data Case: DO-204AP Sintered glass case Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: approx. 560 mg.

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Datasheet Details

Part number GI1001
Manufacturer Vishay
File Size 337.48 KB
Description Ultra Fast Sinterglass Diode
Datasheet download datasheet GI1001 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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VISHAY GI1001 / 1002 / 1003 / 1004 Vishay Semiconductors Ultra Fast Sinterglass Diode Features • High temperature metallurgically bonded construction • Glass passivated cavity-free junction • Superfast recovery time for high efficiency • Low forward voltage, high current capability • Hermetically sealed package • High surge capability Mechanical Data Case: DO-204AP Sintered glass case Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: approx.