GPP100D Key Features
- Glass passivated chip junction
- Low forward voltage drop
- Low leakage current, typical IR less than 0.2 μA
- High forward surge capability
- Meets environmental standard MIL-S-19500
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified
- Material categorization: For definitions of pliance please see .vishay./doc?99912