IHLP-5050FD-AP Description
IHLP-5050FD-AP 4.7 μH ± 20 % MODEL INDUCTANCE VALUE INDUCTANCE TOLERANCE ER e3 PACKAGE CODE JEDEC® LEAD (Pb)-FREE STANDARD GLOBAL PART NUMBER I HLP 5 0 5 0FD.
IHLP-5050FD-AP Key Features
- 13.5 mm x 12.9 mm x 6.4 mm SMD package
- Up to 60 % lower AC losses than traditional
- Magnetically shielded posite construction
- AEC-Q200 qualified
- IHLP design; PATENT(S): .vishay./patents
- Material categorization: for definitions of pliance please see .vishay./doc?99912