IHLP-5050FD-AP
FEATURES
- 13.5 mm x 12.9 mm x 6.4 mm SMD package
- Up to 60 % lower AC losses than traditional core materials gives excellent performance in high ripple conditions and minimizes need for cooling
- Magnetically shielded posite construction
- AEC-Q200 qualified
- IHLP design; PATENT(S): .vishay./patents
- Material categorization: for definitions of pliance please see .vishay./doc?99912
APPLICATIONS
- ADAS, ECU, Li DAR, braking systems
- 5G tele
- DC/DC conversion and filtering
- Drivers for LED lighting and audio
STANDARD ELECTRICAL SPECIFICATIONS
PART NUMBER IHLP5050FDER1R0MAP IHLP5050FDER2R2MAP IHLP5050FDER3R3MAP IHLP5050FDER4R7MAP IHLP5050FDER100MAP
INDUCTANCE ± 20 % AT 0 A
(μH)
1.0 2.2 3.3 4.7 10
DCR TYP. 25 °C (mΩ) 1.5
DCR MAX. 25 °C (mΩ) 1.6
HEAT RATING CURRENT DC TYP.
(A) (1)
SATURATION CURRENT
DC TYP. (A) (2)
20 % DROP 30 %...
