IHPT1411AFELR73ABA Overview
IHPT-1411AF-A MODEL R73 FORCE COEFFICIENT TRAY PACKAGE CODE e3 JEDEC® LEAD (Pb)-FREE STANDARD MATERIAL Core Wire Solder Laminated steel Copper, PU/PA insulated Hot dip tin SOLDER POSITION Sn Cu 99.3 % 0.7 % DIMENSIONS in inches [millimeters].
IHPT1411AFELR73ABA Key Features
- High impulse vibrations for clear tactile
- Standard lead termination is dipped 100 % tin solder; customer specific connectors available upon request
- Two-piece magnetic solenoid construction with mounting holes; prised of stationary “U” core and moving “I-bar”
- AEC-Q200 qualified
- Material categorization: for definitions of pliance please see .vishay./doc?99912