IRF9610S Datasheet | Vishay

FEATURES - Surface-mount - Available in tape and reel - Dynamic d V/dt rating Available - P-channel - Fast switching Available - Ease of paralleling - Simple drive requirements - Material categorization: for definitions of pliance please see .vishay./doc?99912 Note - This datasheet provides information about parts that are Ro HS-pliant and / or parts that are non Ro HS-pliant. For example, parts with lead (Pb) terminations are not Ro HS-pliant. Please see the information / tables in this datasheet for details DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best bination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface-mount power package capable of acmodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface-mount package. The D2PAK (TO-263) is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2 W in a typical surface mount application. ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free Lead (Pb)-free D2PAK (TO-263) Si HF9610S-GE3 Si HF9610STRR-GE3 Si HF9610STRL-GE3 IRF9610SPb F IRF9610STRRPb F IRF9610STRLPb F ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Currenta Linear Derating Factor VGS at -10 V TC = 25 °C TC = 100 °C Linear Derating Factor (PCB mount) d Maximum Power Dissipation Maximum Power Dissipation (PCB mount) d Peak Diode Recovery d V/dt b TC = 25 °C TA = 25 °C PD d V/dt Operating Junction and Storage Temperature Range Soldering Remendations (Peak temperature) c For 10 s TJ,...