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MBR30H150CT Key Features

  • Power pack
  • Guardring for overvoltage protection
  • Low power losses, high efficiency
  • Low forward voltage drop
  • High frequency operation
  • Solder dip 275 °C max. 10 s, per JESD 22-B106
  • Material categorization: For definitions of pliance

Other MBR30H150CT Datasheets

Manufacturer Part Number Description
ON Semiconductor Logo onsemi MBR30H150CTG Power Rectifier

MBR30H150CT Description

MBR30H150CT, MBRF30H150CT, SB30H150CT-1 .vishay.

MBR30H150CT Applications

  • RoHS-pliant, mercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker test Polarity