MPG06K
FEATURES
- Glass passivated chip junction
- Low forward voltage drop
- Low leakage current, typical IR less than 0.1 μA
- High forward surge capability
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified
- Material categorization: For definitions of pliance please see .vishay./doc?99912
PRIMARY CHARACTERISTICS
IF(AV) VRRM
1.0 A
50 V, 100 V, 200 V, 400 V, 600 V, 800 V, 1000 V
IFSM VF at IF = 1.0 A
40 A 1.1 V 5.0 μA
TJ max.
150 °C
Package
MPG06
Diode variations
Single die
TYPICAL APPLICATIONS For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes application.
MECHANICAL DATA Case: MPG06, molded epoxy over passivated chip Molding pound meets UL 94 V-0 flammability rating Base P/N-E3
- Ro HS-pliant, mercial grade Base P/NHE3
- Ro HS-pliant, AEC-Q101 qualified Base P/NHE3_X
- Ro HS-pliant and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B, )
Terminals: Matte tin plated leads, solderable per...
