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MURS140 - Rectifier

Key Features

  • Glass passivated chip junction.
  • Ideal for automated placement.
  • Ultrafast reverse recovery time.
  • Low switching losses, high efficiency.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AA (SMB).
  • Solder dip 260 °C, 40 s.
  • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.

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MURS140 & MURS160 Vishay General Semiconductor Surface Mount Ultrafast Plastic Rectifier FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AA (SMB) • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.