MURS140 Overview
Key Specifications
Package: SMB
Mount Type: Surface Mount
Pins: 2
Height: 2.42 mm
Key Features
- Glass passivated chip junction
- Ideal for automated placement
- Ultrafast reverse recovery time
- Low switching losses, high efficiency
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C DO-214AA (SMB)
- Solder dip 260 °C, 40 s
