SAP MATERIAL AND ORDERING NUMBER (1)
4700
1, 2, 3, 5
3435
1
Bare die with top / bottom silver terminations
NTCC200E4472
T
12 000
1, 2, 3, 5
3740
1
Bare die with top / bottom silver terminations
NTCC200E4123
T
20 000
1, 2, 3, 5
3865
1
Bare die with top / bottom silver termin
Key Features
Flat chip contacted top and bottom
(gold: NTCC300E4 series or silver: NTCC200E4 series).
Green thermistor - does not use RoHS exemptions.
Wide temperature range from -55 °C to +175 °C.
Highly resistant to thermal shocks.
Ideal for wire bonding (aluminum or gold depending on metalization type).
Resistance to leaching.
Delivered on blister tape.
AEC-Q200 qualified.
Material categorization: for definitions of complian.
Full PDF Text Transcription for NTCC200E4 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
NTCC200E4. For precise diagrams, and layout, please refer to the original PDF.
www.vishay.com NTCC200E4, NTCC300E4 Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 ...
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e Bonding QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 °C 4.7K to 20K Tolerance on R25-value B25/85-value Tolerance on B25/85-value Operating temperature range ± 1; ± 2; ± 3; ± 5 3435 to 3865 ±1 -55 to +175 Response time (63.2 %) 25 °C to 85 °C still air (for info) 3 Dissipation factor δ in still air (for info, non-mounted die) 3 Maximum power dissipation 50 Weight 3 UNIT Ω % K % °C s mW mW mg MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material.