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NTCC200E4 - Leadless NTC Thermistor Die Suitable

Description

SAP MATERIAL AND ORDERING NUMBER (1) 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472 T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123 T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom silver termin

Features

  • Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series).
  • Green thermistor - does not use RoHS exemptions.
  • Wide temperature range from -55 °C to +175 °C.
  • Highly resistant to thermal shocks.
  • Ideal for wire bonding (aluminum or gold depending on metalization type).
  • Resistance to leaching.
  • Delivered on blister tape.
  • AEC-Q200 qualified.
  • Material categorization: for definitions of complian.

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Datasheet Details

Part number NTCC200E4
Manufacturer Vishay
File Size 80.38 KB
Description Leadless NTC Thermistor Die Suitable
Datasheet download datasheet NTCC200E4 Datasheet
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www.vishay.com NTCC200E4, NTCC300E4 Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 °C 4.7K to 20K Tolerance on R25-value B25/85-value Tolerance on B25/85-value Operating temperature range ± 1; ± 2; ± 3; ± 5 3435 to 3865 ±1 -55 to +175 Response time (63.2 %) 25 °C to 85 °C still air (for info) 3 Dissipation factor δ in still air (for info, non-mounted die) 3 Maximum power dissipation 50 Weight 3 UNIT Ω % K % °C s mW mW mg MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material.
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