NTCC300E4 Overview
SAP MATERIAL AND ORDERING NUMBER (1) 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472 T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123 T 20 000 1, 2, 3, 5 3865 1 Bare die with top.
NTCC300E4 Key Features
- Flat chip contacted top and bottom
- Green thermistor
- does not use RoHS exemptions
- Wide temperature range from -55 °C to +175 °C
- Highly resistant to thermal shocks
- Ideal for wire bonding (aluminum or gold depending on metalization type)
- Resistance to leaching
- Delivered on blister tape
- AEC-Q200 qualified
- Material categorization: for definitions of pliance please see .vishay./doc?99912