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NTCC300E4 - Leadless NTC Thermistor Die Suitable

Download the NTCC300E4 datasheet PDF. This datasheet also covers the NTCC200E4 variant, as both devices belong to the same leadless ntc thermistor die suitable family and are provided as variant models within a single manufacturer datasheet.

General Description

SAP MATERIAL AND ORDERING NUMBER (1) 4700 1, 2, 3, 5 3435 1 Bare die with top / bottom silver terminations NTCC200E4472 T 12 000 1, 2, 3, 5 3740 1 Bare die with top / bottom silver terminations NTCC200E4123 T 20 000 1, 2, 3, 5 3865 1 Bare die with top / bottom silver termin

Key Features

  • Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series).
  • Green thermistor - does not use RoHS exemptions.
  • Wide temperature range from -55 °C to +175 °C.
  • Highly resistant to thermal shocks.
  • Ideal for wire bonding (aluminum or gold depending on metalization type).
  • Resistance to leaching.
  • Delivered on blister tape.
  • AEC-Q200 qualified.
  • Material categorization: for definitions of complian.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (NTCC200E4-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number NTCC300E4
Manufacturer Vishay
File Size 80.38 KB
Description Leadless NTC Thermistor Die Suitable
Datasheet download datasheet NTCC300E4 Datasheet

Full PDF Text Transcription for NTCC300E4 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for NTCC300E4. For precise diagrams, and layout, please refer to the original PDF.

www.vishay.com NTCC200E4, NTCC300E4 Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 ...

View more extracted text
e Bonding QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 °C 4.7K to 20K Tolerance on R25-value B25/85-value Tolerance on B25/85-value Operating temperature range ± 1; ± 2; ± 3; ± 5 3435 to 3865 ±1 -55 to +175 Response time (63.2 %) 25 °C to 85 °C still air (for info) 3 Dissipation factor δ in still air (for info, non-mounted die) 3 Maximum power dissipation 50 Weight 3 UNIT Ω % K % °C s mW mW mg MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material.

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