PB4008 Overview
Key Specifications
Package: SIP
Mount Type: Through Hole
Pins: 4
Height: 20.3 mm
Key Features
- UL recognition file number E312394 (QQQX2) UL 1557 (see *)
- Enhanced high-current density single in-line package
- Superior thermal conductivity
- Glass passivated chip junction
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- Material categorization: for definitions of compliance please see +~~
