RCP1206 Overview
RCP Vishay Dale Thick Film Chip Resistors, Industrial, High Power, Aluminum Nitride Substrate Aluminum nitride over 3 x more power - same size LINKS TO ADDITIONAL RESOURCES S-Parameters MATERIAL SPECIFICATIONS Resistive element Ruthenium oxide Encapsulation Epoxy Substrate Aluminum nitride Termination Solder-coated nickel barrier Solder finish Pure tin or tin / lead solder alloy.
RCP1206 Key Features
- Thick film resistive element on an aluminum nitride (AlN) substrates
- Very high thermal conductivity in a small package size
- Termination: tin / lead wraparound termination over nickel barrier. Also available with lead (Pb)-free wraparound termin
- Capability to develop specific reliability programs designed to customer requirements
- Operating temperature range: -65 °C to +155 °C
- High frequency performance to 6 GHz
- Material categorization: for definitions of pliance please see .vishay./doc?99912
- This datasheet provides information about parts that are
- Consult factory for availability of additional case sizes (1) The power rating depends on the maximum temperature of the
