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RFLW3N1100B - High Frequency Wire Bondable RF Spiral Inductor

This page provides the datasheet information for the RFLW3N1100B, a member of the RFLW3N3900C High Frequency Wire Bondable RF Spiral Inductor family.

Description

RFLW 30 x 30 NO PASS 20 nH 20 % WS R F LW3 N 2 0 0 0 BMNWS MODEL SIZE PASSIVATION RFLW 3 = 30 x 30 5 = 50 x 50 N = none INDUCTANCE (nH) First 4 digits are significant figures of capacitance INDUCTANCE MULTIPLIER CODE C = 0.001 B = 0.01 A = 0.1 TOLERANCE CODE M = 20 % L = 25 % SPE

Features

  • High frequency.
  • Wire bond assembly.
  • Small size: 0.030" x 0.030" x 0.020".
  • Low DCR, high Q.
  • Low parasitic capacitance, high SRF.
  • Equivalent circuit model enclosed.
  • S parameter files available for download.
  • Sample kit available.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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Datasheet preview – RFLW3N1100B

Datasheet Details

Part number RFLW3N1100B
Manufacturer Vishay
File Size 377.10 KB
Description High Frequency Wire Bondable RF Spiral Inductor
Datasheet download datasheet RFLW3N1100B Datasheet
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Full PDF Text Transcription

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www.vishay.com RFLW 3N Vishay Electro-Films High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" RFLW series of thin film spiral inductors on quartz are designed for RF circuits that require wire bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Measured S parameter files are also available upon request. In many RF applications, correct component selection is achieved through experimentation. To help designers during the design process, a sample kit of standard values is available. Additional values and form factors available upon request. FEATURES • High frequency • Wire bond assembly • Small size: 0.030" x 0.030" x 0.
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