RGP20J Key Features
- Superectifier structure for high reliability condition
- Cavity-free glass-passivated junction
- Fast switching for high efficiency
- Low leakage current, typical IR less than 0.2 μA
- High forward surge capability
- Meets environmental standard MIL-S-19500
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified