SMBG26 Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated chip junction
- Available in unidirectional and bidirectional
- 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %
- Excellent clamping capability
- Very fast response time
- Low incremental surge resistance
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
