SMBJ14 Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated chip junction
- Available in uni-directional and bi-directional
- 600 W peak pulse power capability with a
- Excellent clamping capability
- Very fast response time
- Low incremental surge resistance
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Solder dip 260 °C, 40 s
