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SMBJ5.0 - Transient Voltage Suppressors

Key Features

  • Low profile package.
  • Ideal for automated placement.
  • Glass passivated chip junction.
  • Available in uni-directional and bi-directional.
  • 600 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 %.
  • Excellent clamping capability.
  • Very fast response time.
  • Low incremental surge resistance.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C.
  • Solder dip 260 °C, 40 s.

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Datasheet Details

Part number SMBJ5.0
Manufacturer Vishay
File Size 107.13 KB
Description Transient Voltage Suppressors
Datasheet download datasheet SMBJ5.0 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SMBJ5.0 thru SMBJ188CA Vishay General Semiconductor Surface Mount TRANSZORB® Transient Voltage Suppressors DO-214AA (SMB J-Bend) PRIMARY CHARACTERISTICS VWM PPPM IFSM (uni-directional only) TJ max. 5.0 V to 188 V 600 W 100 A 150 °C DEVICES FOR BI-DIRECTION APPLICATIONS For bi-directional devices use C or CA suffix (e.g. SMBJ10CA). Electrical characteristics apply in both directions. FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.