Download the SMBJ60 datasheet PDF.
This datasheet also covers the SMBJ5.0 variant, as both devices belong to the same transient voltage suppressors family and are provided as variant models within a single manufacturer datasheet.
Key Features
Low profile package.
Ideal for automated placement.
Glass passivated chip junction.
Available in uni-directional and bi-directional.
600 W peak pulse power capability with a
10/1000 µs waveform, repetitive rate (duty cycle): 0.01 %.
Excellent clamping capability.
Very fast response time.
Low incremental surge resistance.
Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C.
Full PDF Text Transcription for SMBJ60 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
SMBJ60. For precise diagrams, and layout, please refer to the original PDF.
SMBJ5.0 thru SMBJ188CA Vishay General Semiconductor Surface Mount TRANSZORB® Transient Voltage Suppressors DO-214AA (SMB J-Bend) PRIMARY CHARACTERISTICS VWM PPPM IFSM (un...
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essors DO-214AA (SMB J-Bend) PRIMARY CHARACTERISTICS VWM PPPM IFSM (uni-directional only) TJ max. 5.0 V to 188 V 600 W 100 A 150 °C DEVICES FOR BI-DIRECTION APPLICATIONS For bi-directional devices use C or CA suffix (e.g. SMBJ10CA). Electrical characteristics apply in both directions. FEATURES • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.