T1070P Key Features
- Package type: chip
- Package form: single chip
- Dimensions (L x W x H in mm): 0.72 x 0.72 x 0.22
- Wafer diameter (in mm): 100
- Radiant sensitive area (in mm2): 0.25
- High photo sensitivity
- Suitable for visible light
- Fast response times
- Angle of half sensitivity: ϕ = ± 60°
- Material categorization: for definitions of pliance
