UG30BPT-E3
FEATURES
- Power pack
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low forward voltage drop
- High forward surge capability
- Solder dip 275 °C max., 10 s per JESD 22-B106
- Material categorization: for definitions of pliance please see .vishay./doc?99912
TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, DC/DC converters, and other power switching application.
MECHANICAL DATA Case: TO-247AD (TO-3P) Molding pound meets UL 94V-0 flammability rating Base...
