VS-100MT160P-P Overview
The new MTP module is easy to use thanks to solder less method for contacting PressFit pins to the PCB. The low profile package has been specifically conceived to maximize space saving and optimize the electrical layout of the application specific power supplies. 18-Mar-14 1 Document Number:.
VS-100MT160P-P Key Features
- Low VF
- Low profile package
- Direct mounting to heatsink
- PressFit pins technology
- Low junction to case thermal resistance
- 3500 VRMS insulation voltage
- UL approved file E78996
- Designed and qualified for industrial level
- Material categorization: For definitions of pliance