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VS-70MT160P-P - MTP PressFit Power Module

Download the VS-70MT160P-P datasheet PDF. This datasheet also covers the VS-40MT160P-P variant, as both devices belong to the same mtp pressfit power module family and are provided as variant models within a single manufacturer datasheet.

Description

The new MTP module is easy to use thanks to solder less method for contacting PressFit pins to the PCB.

The low profile package has been specifically conceived to maximize space saving and optimize the electrical layout of the application specific power supplies.

Features

  • Low VF.
  • Low profile package.
  • Direct mounting to heatsink.
  • PressFit pins technology.
  • Low junction to case thermal resistance.
  • 3500 VRMS insulation voltage.
  • UL approved file E78996.
  • Designed and qualified for industrial level.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VS-40MT160P-P-Vishay.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Vishay

Part Number Description
VS-70MT160P Three Phase Bridge
VS-70MT160P.PbF Three Phase Bridge
VS-70MT1.0P.PbF Three Phase Bridge
VS-70MT140P Three Phase Bridge
VS-70MT060WHTAPbF IGBT MTP

Full PDF Text Transcription

Click to expand full text
VS-40MT160P-P, VS-70MT160P-P, VS-100MT160P-P www.vishay.com Vishay Semiconductors MTP PressFit Power Module Three Phase Bridge, 45 A to 100 A MTP PressFit PRODUCT SUMMARY IO VRRM Package Circuit 45 A to 100 A 1600 V MTP PressFit Three phase bridge FEATURES • Low VF • Low profile package • Direct mounting to heatsink • PressFit pins technology • Low junction to case thermal resistance • 3500 VRMS insulation voltage • UL approved file E78996 • Designed and qualified for industrial level • Material categorization: For definitions of compliance please see www.vishay.
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