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VS-GB300TH120U - Molding Type Module IGBT

Description

Vishay’s IGBT power module provides ultra low conduction loss as well as short circuit ruggedness.

It is designed for applications such as electronic welder and inductive heating.

Features

  • 10 μs short circuit capability.
  • VCE(on) with positive temperature coefficient.
  • Maximum junction temperature 150 °C.
  • Low switching losses.
  • Rugged with ultrafast performance.
  • Low inductance case.
  • Fast and soft reverse recovery antiparallel FWD.
  • Isolated copper baseplate using DCB (Direct Copper Bonding) technology.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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VS-GB300TH120N Molding Type Module IGBT
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Full PDF Text Transcription

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www.vishay.com VS-GB300TH120U Vishay Semiconductors Molding Type Module IGBT, 2-in-1 Package, 1200 V and 300 A Double INT-A-PAK PRODUCT SUMMARY VCES IC at TC = 80 °C VCE(on) (typical) at IC = 300 A, 25 °C Package Circuit 1200 V 300 A 3.10 V Double INT-A-PAK Half bridge FEATURES • 10 μs short circuit capability • VCE(on) with positive temperature coefficient • Maximum junction temperature 150 °C • Low switching losses • Rugged with ultrafast performance • Low inductance case • Fast and soft reverse recovery antiparallel FWD • Isolated copper baseplate using DCB (Direct Copper Bonding) technology • Material categorization: for definitions of compliance please see www.vishay.
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