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VS-GT400TH120U - Molding Type Module IGBT

Description

Vishay’s IGBT power module provides ultralow conduction loss as well as short circuit ruggedness.

Features

  • Low VCE(on) trench IGBT technology.
  • 10 μs short circuit capability.
  • VCE(on) with positive temperature coefficient.
  • Maximum junction temperature 175 °C.
  • Low inductance case.
  • Fast and soft reverse recovery antiparallel FWD.
  • Isolated copper baseplate using DCB (Direct Copper Bonding) technology.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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Full PDF Text Transcription

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www.vishay.com VS-GT400TH120U Vishay Semiconductors Molding Type Module IGBT, 2-in-1 Package, 1200 V, 400 A Double INT-A-PAK PRODUCT SUMMARY VCES IC at TC = 80 °C VCE(on) (typical) at IC = 400 A, 25 °C Speed Package Circuit 1200 V 400 A 1.90 V 8 kHz to 30 kHz Double INT-A-PAK Half bridge FEATURES • Low VCE(on) trench IGBT technology • 10 μs short circuit capability • VCE(on) with positive temperature coefficient • Maximum junction temperature 175 °C • Low inductance case • Fast and soft reverse recovery antiparallel FWD • Isolated copper baseplate using DCB (Direct Copper Bonding) technology • Material categorization: for definitions of compliance please see www.vishay.
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