VS-UFH60BA65 Description
The semiconductor in the SOT-227 package is isolated from the copper base plate, allowing for mon heatsinks and pact assemblies to be built. - 2.35 100 - UNITS V μA V Revision: 02-Feb-2024 1 Document Number:.
VS-UFH60BA65 Key Features
- Hyperfast and soft recovery characteristic
- Electrically isolated base plate
- Simplified mechanical designs, rapid assembly
- High operation junction temperature (TJ max. = 175 °C)
- Designed and qualified for industrial and consumer level
- UL approved file E78996
- Material categorization: for definitions of pliance
- Bridge, Hyperfast
- 55 to +175
- 2.35 100