VS-VSKCS200-045 Overview
The AAP Gen 7, new generation of ADD-A-PAK module, bines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced pact simple package solution and simplified internal structure with minimized number of interfaces.
VS-VSKCS200-045 Key Features
- 150 °C TJ operation
- Low forward voltage drop
- High frequency operation
- Low thermal resistance
- UL approved file E78996
- Designed and qualified for industrial level
- Material categorization: for definitions of pliance
- High surge capability
- Easy mounting on heatsink