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VSKCL240 - Fast Recovery Diodes

Download the VSKCL240 datasheet PDF. This datasheet also covers the VSKDL240 variant, as both devices belong to the same fast recovery diodes family and are provided as variant models within a single manufacturer datasheet.

General Description

The VSK.L240 Series of MAGN-A-PAKsTM uses fast recovery power diodes in four basic configurations.

The semiconductors are electrically isolated from the metal base, allowing common heatsinks and compact assemblies to be built.

Key Features

  • Fast recovery time characteristics.
  • Electrically isolated base plate.
  • Industrial standard package.
  • Simplified mechanical designs, rapid assembly.
  • High surge capability.
  • Large creepage distances.
  • 3000 VRMS isolating voltage MAGN-A-PAKTM RoHS.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VSKDL240_Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VSKCL240
Manufacturer Vishay
File Size 352.58 KB
Description Fast Recovery Diodes
Datasheet download datasheet VSKCL240 Datasheet

Full PDF Text Transcription for VSKCL240 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for VSKCL240. For precise diagrams, and layout, please refer to the original PDF.

www.DataSheet.co.kr VSK.L240 Series Vishay High Power Products Fast Recovery Diodes, 250 A (MAGN-A-PAKTM Power Modules) FEATURES • Fast recovery time characteristics • El...

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AKTM Power Modules) FEATURES • Fast recovery time characteristics • Electrically isolated base plate • Industrial standard package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • 3000 VRMS isolating voltage MAGN-A-PAKTM RoHS COMPLIANT • UL E78996 approved • Lead (Pb)-free • Designed and qualified for industrial level DESCRIPTION PRODUCT SUMMARY IF(AV) 250 A The VSK.L240 Series of MAGN-A-PAKsTM uses fast recovery power diodes in four basic configurations. The semiconductors are electrically isolated from the metal base, allowing common heatsinks and compact assemblies to