VSKDS303-100P Overview
The Gene ration 5 of ADD-A-PAK modul e bi ne the excellent th ermal performance obtai ned by the usage of direct bond ed co pper substrate with supe rior mechanical ruggedness, than ks to th e insertion of a soli d coppe r baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsin k with in creased tole rance of su rface rou ghness and improved thermal spread....
VSKDS303-100P Key Features
- 175 °C TJ operation
- Low forward voltage drop
- High frequency operation
- Guard ring reliability
- UL pending
- Totally lead (Pb)-free, RoHS pliant
- Designed and qualified for industrial level
VSKDS303-100P Applications
- 55 to 175 UNITS A V A V °C