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VSKT105-16S90P - ADD-A-PAK Generation VII Power Modules

Download the VSKT105-16S90P datasheet PDF. This datasheet also covers the VSKT106-16S90P variant, as both devices belong to the same add-a-pak generation vii power modules family and are provided as variant models within a single manufacturer datasheet.

General Description

The ADD-A-PAK Generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

Key Features

  • High voltage.
  • Industrial standard package.
  • Low thermal resistance.
  • UL approved file E78996.
  • Designed and qualified for industrial level.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (VSKT106-16S90P-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number VSKT105-16S90P
Manufacturer Vishay
File Size 309.43 KB
Description ADD-A-PAK Generation VII Power Modules
Datasheet download datasheet VSKT105-16S90P Datasheet

Full PDF Text Transcription for VSKT105-16S90P (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for VSKT105-16S90P. For precise diagrams, and layout, please refer to the original PDF.

VSKT105.., VSKH105.., VSKL105.., VSKN105.. Series www.vishay.com Vishay Semiconductors ADD-A-PAK Generation VII Power Modules Thyristor/Diode and Thyristor/Thyristor, 105...

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eration VII Power Modules Thyristor/Diode and Thyristor/Thyristor, 105 A ADD-A-PAK PRODUCT SUMMARY IT(AV) or IF(AV) Type 105 A Modules - Thyristor, Standard MECHANICAL DESCRIPTION The ADD-A-PAK Generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

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