UH3C Description
.DataSheet.co.kr New Product UH3B, UH3C & UH3D Vishay General Semiconductor Surface Mount Ultrafast Rectifier.
UH3C Key Features
- Low profile package
- Ideal for automated placement
- Oxide planar chip junction
- Ultrafast recovery times for high frequency
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Solder dip 260 °C, 40 s
- pliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC