SK55A
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space. Fea
- tuLorewspower loss, high efficiency. ‧L
- owHipgrhofciluerpreanckt acgaepability, low forward voltage drop. ‧Id
- eHaligfohr ‧G *
- owSifloicrwonaredpvitoaltxaigael pdlraonpar chip, metal silicon junction. ‧C
- omLepaodn-efnret einpaacrctsormdaenecteentovRiroonHmSe2n0t0a2l /s9t5a/nEdCards of ‧Pb-MFIrLe-eSpTaDc-k1a9g5e00is/2a2v8ailable R
- oRHoSHpSropdroudcutcftofropr apcakcikninggccooddeessuuffffiix ”"G"” HaHloagleongefnrefereperpordoudcutcftofor rpp
