WILLAS 2SA1201
Plastic-Encapsulate Transistors
FEATURES
● Batch process design, excellent power dissipation offers TRANbSetItSerTrOevRers(Pe NleaPk)age current and thermal resistance.● Low profile surface mounted application in order to FEAToUpRtimEiSze board space. z
●●HHLiogigwhhpcvouowrlretearngltoecsasp, ah igh efficiency. bility, low forward vol tage d ro p. z
●HHigighh struargnesictaiopnabfirleityq.uency z
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● Ultra high-speed switching.
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●HLaelaodg-ferenefrpeaertspmroedeut ecnt vfioror npmaecnktianlgstcaonddaerdssuofffix “H” MIL-STD-19500 /228 MAX● IRMoHUSMprRodAucTtIfNorGpaSck(inTga=co2d5e℃sufufixn"lGe"ss otherwise noted) SymMbHoeallcoghenafrneeicpraodluPdcatrafaotrmap