BAV16W
Overview
- RBEatSch process design, excellent power dissipation offers Package outline SOD-123 z Fasbt eSttweritrcehveinrsgeSlepaekeagde current and thermal resistance.
- Low profile surface mounted application in order to z Ideally Suited for Automatic Insertion SOD-123H + z Fo
- rLGowenpeowraelr Ploussrp, hoisgeh eSffwiciitecnhciyn. g Applications
- High current capability, low forward voltage drop. z Hig
- hHiCghosnudrguecctaanpacbeility. z Pb
- -GFuraeredrpinagcfokraogveerviosltaagveapirloatbecletion.
- 146(3.7) 0.130(3.3) Ro
- HUSltraphroigdhu-scpteefodrswpaitcchkiningg. code suffix ”G”
- Silicon epitaxial planar chip, metal silicon junction. Ha
- loLegaedn-frfereepeaprtrsomdeuect tenfovirropnamceknitnagl stcaonddaerdssuofffix “H” MARK
