BC858BDW1T1
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to SOD-123H optimize board space.
- Low power loss, high efficiency. ad * * *
- ,- hiacmhpliisfier
- 146(3.7) 0.130(3.3)
- WSielicdoencleapreitathxaiatltphleanmaartcehriiapl, omf eptraoldsuilcict ocnomjupnlciatinocne. with RoHS requirements. * *
- RLDMBeoeICHaLvd-8SiSc-5fpTe6rreDoAMed-D1uapc9rWatk5rfit01ons0rTgmp/1:2ae=c2ek83tinAegnvcoirdoenmsueffnixta"Gl s"tan d
