BCX55
Features
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Low power loss, high efficiency.
TRANSIS-
- HHTii Ogghh Rscuu(Nrrgre Pen Nct ac)paapbaibliitlyit.y, low forward voltage drop.
- Guardring for overvoltage protection.
FEATUR-
- ESUSilltircaohnigehp-itsapxeiaeldpslawnitacrhcinhgip. , metal silicon junction. z PNP- LCeoamd-fpreleempaerntstsmteoet Be Cnv Xir5on1m,Be Cnt Xal5s2ta,Bnd Ca Xrd5s3of z
Low-
VRMoo IHLlt-Sa Sgp Tre Dod-1uc9t5f0o0r
/228 packing code suffix
"G" z High HCaulorgreennftree product for packing code suffix "H" z Pb-FMreechpaacnkiacgaelids avtailable
Ro H- SEpporxoyd: u Uc Lt94fo-Vr 0praactekdinflgamceordeetasrduafnfitx ”G”
Halo- g Ceansef:re Meolpderod dpluacstticfo, Sr Op Da-c1k2i3n Hg code suffix “H”
- Terminals :Plated terminals, solderable per MIL-STD-75
, 0
Method 2026
APPLIC- APTo Il Oar Nity S: Indicated by cathode band z...
