BSS138LT1
Features
Package outline
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to
SOD-123H optimize board space.
N-
- CLohwaponwner elosls S, hi Ogh Teff- ic2ien3cy.
- High current capability, low forward voltage drop.
0.146(3.7) 0.130(3.3)
0.012(0.3) Typ.
Typi- ca Hligahpspulricgaetcioanpsabailritey. dc- dc converters, power management in porta- b Gleuaardnrdingbafottreorvye- rpvoolwtaegreepdroptreocdtiuocnt.s such as puters, printers,
- PCM-
- CSUIil Altircacohanirgedhps-i,tsapcxeeiaelllduplsalawrniatacnrhdcinhcgipo. ,rmdleetsasl telephones. silicon junction.
Lo- w Le Tahdr-ferseheopladrt Vsomlteaegteen(Vvir Go Sn(tmh)e: n0t.a5l Vs.t.a.1n.d5a Vrd)smoaf kes it ideal for low
0.071(1.8)...
