DTC123JCA
Overview
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Low power loss, high efficiency.
- High current capability, low forward voltage drop. Features
- High surge capability.
- Epitax *
- leSmiliecnontaerpyitNaxPiNal pTlyapnaerscAhivpa, imlaebtlael silicon junction.
- Built-I
- nLBeiaads-ifnregeRpeasrtisstmoerset environmental standards of
- Pb-FreMe IpLa-ScTkDa-g1e95i0s0a/2v2a8ilable RoHS
