MMBD4448V
Overview
- Batch process design, excellent power dissipation offers SWITC
- HLbIoeNwt tGeprrroDefviIlOeersDsueErlfeaackeamgoeucnutrerde natpapnl idc at ht ieornmianlorredsei sr ttaon c e . FEATURoEptSimize board space. z Fa
- stLoswwpitocwheinr glosssp, eheigdh efficiency.
- High current capability, low forward voltage drop. z Hig
- hHicgohnsdurugcetacanpcaebility. z Pb
- -FGreuaerpdraincgkafogreoviseravvoaltialagbe lperotection. Ro
- HUSltprarohdiguhc-tsfpoer epdacswkiintcghcinogd.e suffix ”G”
- Silicon epitaxial planar chip, metal silicon junction. Ha
- loLgeeandf-rfereeeppraordtsucmtefeotrepnavcirkoinngmceondtael sstuafnfidxa“rHds” of z MoisMtuILr-eSSTDen-1s9i5ti0v0it/y22L8evel 1
- RoHS product for packing code suffix "G" Halogen free product for packing code suffix "H" Mechanical data MARKI
