Click to expand full text
WILLAS
3.01A.0SAUSFURRAFACCEEMMOOUUNNTT SSCUHPOETRTKFYABSATRRRIEECRSTSRMIOFECDCIE--TL1RI2FS3IPE+A-R5CSP0K-A-26AC00VGK0-AEV2G0E0V
S F MFM3T11HL2R0U-M+ S FTFHMPMbR3FU1r8e2eL0P0ro-dMuc+t
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
Feaotputirmeizse board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop. • Batch process design, excellent power dissipation offers
be•tteHrigrehvseurrsgeelecaakpaagbeilictyu.rrent and thermal resistance. • Lo•wGpuroafridlerisnugrffaocr eovmeorvuonltteadgeappprolitceacttioionni.n order to
op•timUlitzrea bhoigahrd-ssppeaecdes. witching. • Hig•hSciluicrroennet pciatapxaibail iptyla.