SKFM1060Y-D Datasheet | WILLAS

Features Package outline SOD-123H Features optimize board space. - Low profile surface mounted application in order to Package outline 0.146(3.7) 0.130(3.3) DPAK 0.012(0.3) Typ. process excellent power dissipation offers - Batch powerdesign, loss, high efficiency. - Low better reverse leakage current and thermal resistance. current capability, low forward voltage drop. - High profile surface mounted application in order to - Low surge capability. - High optimize board space. - Guardring for overvoltage protection. - Low power loss, high efficiency. - Ultra high-speed switching. - High current capability, low forward voltage drop. - Silicon epitaxial planar chip, metal silicon junction. - High surge capability. - Lead-free parts meet environmental standards of for overvoltage - Guardring MIL-STD-19500 /228 protection. high-speed - Ultra productswitching. for packing code suffix "G" - Ro HS epitaxial metal silicon junction. - Silicon Halogen free planar productchip, for packing code suffix "H" Sensitivity Level 1 - Moisture Mechanical data 0.048(1.20) 0.031(0.80) 0.264(6.70) 0.248(6.30) 0.217(5.50) 0.201(5.10) 0.098(2.50) 0.083(2.10) 0.071(1.8) 0.056(1.4) 0.024(0.60) 0.016(0.40) 0.244(6.20) 0.228(5.80) 0.040(1.0)   Ratings at 25℃ ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive of inductive load. For capacitive load, derate current by 20% RATINGS Marking Code 0.024(0.6) - Epoxy : UL94-V0 rated flame retardant 0.024(0.60) 0.016(0.40) 0.114(2.90) - Case : Molded plastic, SOD-123H 0.039(1.00) 0.031(0.8) Typ. 0.031(0.8) Typ. 0.098(2.50) 0.031(0.80) , Mechanical data - Terminals :Plated terminals, solderable per MIL-STD-750 - Epoxy:UL94-V0Method rated flame 0.185(4.70) 2026retardant 0.169(4.30) 0.032(0.80) Dimensions in inches and (millimeters) - Polarity : Indicated by cathode...