SMB2EZ75D5 Overview
Key Features
- Glass passivated chip
- Built-in strain relief
- Low inductance
- High peak reverse power dissipation
- For use in stabilizing and clipping circuits with high power rating
- RoHS product for packing code suffix "G" Halogen free product for packing code suffix "H" .083(2.11) .075(1.91) MECHANICAL DATA
- Case: DO-214AA/SMB, Molded Plastic
- Epoxy: UL 94V-0 rate flame retardant
- Lead: Solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
