D2KB20
Features
- pact Package 3.1mm Case Thickness
- Glass Passivated Die Construction
- Low Forward Voltage Drop
- High Forward Current Capability
- High Reliability
- High Surge Current Capability
- Ideal for Printed Circuit Boards
Mechanical Data
- Case: D3K, Molded Plastic
- Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
- Polarity: As Marked on Body
- Weight: 1.5 grams (approx.)
- Marking: Type Number
- Mounting Position: Any
- Mounting Torque: 0.8 N.m Max.
- Lead Free: For Ro HS / Lead Free Version,
Add “-LF” Suffix to Part Number, See Page 4
+~ ~-
C PP P
D3K Dim Min Max
A 13.30 14.30 B 10.30 11.30 C 13.10 13.50 D 6.40 7.40 E 4.50 6.10 G 1.05 1.45 H 0.60 0.85 J 2.60 3.60 K 3.10 3.40 L 2.00 2.20 M 0.40 0.60 P 3.70 3.90 All Dimensions in mm
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Symbol...
