D3KB40
Key Features
- pact Package 3.1mm Case Thickness
- Glass Passivated Die Construction
- Low Forward Voltage Drop
- High Forward Current Capability
- High Reliability
- High Surge Current Capability
- Ideal for Printed Circuit Boards E G Mechanical Data
- Case: D3K, Molded Plastic
- Terminals: Plated Leads Solderable per MIL-STD-202, Method 208
- Polarity: As Marked on Body
