MBRD3100
Key Features
- Schottky Barrier Chip
- Guard Ring Die Construction for Transient Protection
- High Surge Current Capability
- Low Power Loss, High Efficiency
- Ideally Suited for Automatic Assembly
- For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Applications Mechanical Data
- Case: DPAK/TO-252, Molded Plastic
- Terminals: Plated Leads Solderable per MIL-STD-202, Method 208
- Polarity: See Diagram
- Weight: 0.3 grams (approx.)
