MURD530 Overview
Key Features
- Glass Passivated Die Construction
- Ideally Suited for Automatic Assembly
- Low Profile Package
- High Surge Current Capability
- Low Power Loss, High Efficiency
- Super-Fast Recovery Time
- Ideally Suited for Use in High Frequency SMPS, Inverters and As Free Wheeling Diodes Mechanical Data
- Case: DPAK/TO-252, Molded Plastic
- Terminals: Plated Leads Solderable per MIL-STD-202, Method 208
- Polarity: See Diagram
