UF3G
Overview
- Glass Passivated Die Construction
- Ideally Suited for Automatic Assembly
- Low Forward Voltage Drop, High Efficiency
- Surge Overload Rating to 100A Peak
- Low Power Loss A
- Ultra-Fast Recovery Time
- Ideally Suited for Use in High Frequency SMPS, Inverters and As Free Wheeling Diodes C B F H G E
- Mechanical Data
- Case: SMC/DO-214AB, Molded Plastic
- Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026
