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BOARD LEVEL HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
216 SERIES
Standard P/N 216-40CT 216-40CTT 216-40CTR
Surface Mount Heat Sinks
Height Above PC Board .390 in. (9.9) .390 in. (9.9) .390 in. (9.9) Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 25 250
D 2PAK, TO-220, SOL-20
Thermal Performance at Typical Load Natural Convection Forced Convection 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM
PATENT 361317
Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of high-speed, automated pick and place assembly technology.
236 Datasheet
