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WIMN10 - Surface Mount Switching Multi-Chip Diode Array

Features

  • Ultra High Speed Switching.
  • Ultra-Small Surface Mount Package.
  • For General Purpose Switching.

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Datasheet Details

Part number WIMN10
Manufacturer Weitron Technology
File Size 284.61 KB
Description Surface Mount Switching Multi-Chip Diode Array
Datasheet download datasheet WIMN10 Datasheet

Full PDF Text Transcription

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WIMN10 Surface Mount Switching Multi-Chip Diode Array P b Lead(Pb)-Free MULTI-CHIP DIODES 100m AMPERES 80 VOLTS Features: * Ultra High Speed Switching * Ultra-Small Surface Mount Package * For General Purpose Switching Applications * High Conductance Power Dissipation 6 1 TSOP-6 Mechanical Data: * Case : TSOP-6 * Case Material : Molded Plastic. UL Flammability Classification Ration 94V-0 * Moisture Sensitivity : Level 1 per J-STD-020C * Terminals : Solderable per MIL-STD-202, Method 208 * Polarity : See Diagram TSOP-6 Outline Dimensions A Unit:mm TSOP-6 6 5 4 B C 1 2 3 D H K Ө L M www.DataSheet4U.com J Dim A B C D Ө H J K L M Min 0.25 1.30 2.50 0.85 0° 2.90 0.01 0.90 0.20 0.10 Max 0.50 1.70 3.00 1.05 10° 3.10 0.10 1.10 0.60 0.26 WEITRON http://www.weitron.com.
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